Mobile Phone Copper Sheet Tablet Dissip Uniform Plate Increases Heat Dissipation Area_voghion.com
Mobile Phone Copper Sheet Tablet Dissip Uniform Plate Increases Heat Dissipation Area_voghion.com
Mobile Phone Copper Sheet Tablet Dissip Uniform Plate Increases Heat Dissipation Area_voghion.com
Mobile Phone Copper Sheet Tablet Dissip Uniform Plate Increases Heat Dissipation Area_voghion.com
Mobile Phone Copper Sheet Tablet Dissip Uniform Plate Increases Heat Dissipation Area_voghion.com
Mobile Phone Copper Sheet Tablet Dissip Uniform Plate Increases Heat Dissipation Area_voghion.com
Mobile Phone Copper Sheet Tablet Dissip Uniform Plate Increases Heat Dissipation Area_voghion.com
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Mobile Phone Copper Sheet Tablet Dissip Uniform Plate Increases Heat Dissipation Area

€51.47€67.77
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€5 OFF For orders €50
€3 OFF For orders €30
€2 OFF For orders €2.01
Color : style B
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About this item

Sourced from koko3C
Seller assumes all responsibility for this listing.Item number: 39225330
Item specifics
Item description from the seller
Please select the correct specifications according to the size of the phone, excluding the radiator and mobile phone The product comes with glue that sticks directly to the back of the phone. Supports clip cooler and magnetic cooler. this heatsink compatible for using with radiator/cooler with peltier, not recommended for just passive heatsink if your phone has high temperature because of playing games, recording, etc. Material: copper
Mobile Phone Heat Sink Copper Plate For Better Thermal Efficiency_voghion.comMobile Phone Heat Sink Copper Plate For Better Thermal Efficiency_voghion.com